OUR BUSINESS
System Division
home > OUR BUSINESS > System Division
AI KOREA System Division
- AP(Atmospheric Pressure) Plasma
- Ultrasonic Dry Cleaner(USC)
- Automated Equipment
AP Plasma Technology
Mainly used in semiconductor, LCD and OLED processes, AP Plasma is a dry eco-friendly
cleaner system that uses oxygen radicals activated by plasma, instead of the conventional
wet cleaning method using DIwater, to remove organic matter and reform the surface
- O radicals are created when plasma is ‘ON.’
- An organic matter consists of C-H-O, each of which chemically reacts with O radical for cleaning
※ CO2 when reacted with C, H2O when reacted with H, and chain reaction when reacted with O
Advatages & Key Features
Minimizing process gas usage through the simulation results of the research team and internal case con guration design technology
Internally developed & produced low Hz and low energy power supply technologies
Internal precise machining technology & department for internal production of all processed goods
Effective inner metal with high voltage & low energy through consistent research
Thin film ceramic production through AIK’s own precise ceramic design & machining technologies
0% abnormal discharge and maximal plasma effi ciency with AIK’s own ceramic Ass’y technology
Competitveness
→ No additionally purchased product
→ Owned technology
→ Internal production
- all components internally manufactured
→ A ll components internally produced by the department of machining with years of know-hows
→ 0 % abnormal discharge, low power consumption, low temperature, and high performance
→ Definite reduction in running cost (Gas cost/electricity cost)
Reliability
Zero product risk of fire!!
No electric shock for operators,
No damage to product features and appearance!!
Product/human safety with low heat